ALPHA Telecore HF-850
Halogen-Free, Halide-Free, No-Clean, Cored Solder Wire- 1. ALPHA HF-850 in combination with our Innolot alloy offers the highest thermo-mechanical reliability.
- 2. Halide-free per IPC J-STD-004 and complies with IPC ROLO standard.
- 3. Very fast wetting for excellent component touch-up operations and manual assembly.
- 4. Halogen-free chemistry allows use of HF-850 in processes requiring halogen-free materials.
- 5. Very low flux spatter and low levels of fumes for operator friendly use and a cleaner working environment.
- 5.Clear non-tacky residue does not require cleaning.
- 5.Good spread characteristics improve first pass yield per JIS (>80%).
- 5.Excellent joint appearance for easy inspection.
Fast Wetting and Low Spattering Cored Solder Wire
ALPHA Telecore HF-850 is the fastest wetting and lowest spattering, Halogen-Free and Halide-Free cored wire offering from Alpha. It provides excellent performance when benchmarked against Halogen and Halide containing competitive products available on the market and is a viable option to meet environmental requirements. ALPHA Telecore HF-850's rapid wetting enables its use in drag soldering and minimizes cycle time in robotic and hand soldering applications. Its clear residue allows easy inspection of solder joints and the very low spatter rate ensures board cosmetics and user comfort are maintained. All this translates to a safe and environmentally compliant product that is operator friendly while maintaining high levels of productivity.
Technical Specifications
| Standard | Alloy* Description |
Melting or Solidus/ Liquidus Temperature °C |
Flux Configuration |
|---|---|---|---|
| Proprietary | Innolot** | 206–218 | 2.2% |
| J-STD-006C | SAC305 | 217–221 | 1.1%, 2.2% & 3.3% |
| Proprietary | SACX® Plus 0307 | 217–228 | 2.2% & 3.3% |
| J-STD-006C | Sn99.3/Cu0.7 | 227 | 2.2% & 3.3% |
| J-STD-006C | Sn63/Pb37 | 183 | 1.1%, 2.2% & 3.3% |
| Proprietary | SnCX Plus 07 | 227–229 | 2.2% & 3.3% |
* Telecore HF-850 is also available in other alloys upon request.
** All electronic components used with Innolot solder alloy must be lead-free to eliminate the formation of tin / lead / bismuth intermetallic which has a melting point under 100°C.
ALPHA Telecore HF-850 is a Halogen-Free product and passes the standards listed in the Table below:
Halogen Standards
| Standard | Requirement | Test Method | Status |
|---|---|---|---|
| IEC 612249-2-21 | Post Soldering Residues contain <900 ppm each or total of <1500 ppm Br or Cl from flame retardant source | TM EN 14582 | Pass |
| JEDEC: A Guideline for Defining “Low Halogen” Electronics | Post soldering residues contain <1000 ppm Br or Cl from flame retardant source | Pass |
| Physical Properties | Typical Values |
|---|---|
| Rosin Softening Point: | 70-80°C |
| Acid Value: | 180-200mg KOH/g flux |
| Halide Content: | <500ppm per IPC J-STD-004 |
| Classification: | IPC – ROL0 |
| Shelf Life / Storage Temperature: | 36 months / 0° – 40° |
| Electrical Reliability Test | Requirements | Results |
|---|---|---|
| Damp Heat Test (IEC 60068-2-78) | 1.0 × 108 Ω minimum*** | Pass |
| JIS SIR Test (JIS Z 3197) | 1.0 × 1011 Ω minimum | Pass |
| IPC SIR Testing (J-STD-004A) | 1.0 × 108 Ω minimum | Pass |
| IPC SIR Testing (J-STD-004B) | 1.0 × 108 Ω minimum | Pass |
| Bellcore SIR Test (GR-78-CORE) | 1.0 × 1011 Ω minimum | Pass |
| Bellcore EM Test (GR-78-CORE) | SIR(initial) / SIR(final) <10 | Pass |
*** IEC 60068-2-78 does not specify a minimum resistance value. Alpha has adopted the stated value.
| Chemical Reliability Test | Requirements | Results |
|---|---|---|
| Copper Mirror Test (JIS) | No complete removal of copper | Pass |
| Copper Mirror Test (IPC-TM 650 TM 2.3.32) | No complete removal of copper | Pass |
| Copper Corrosion Test JIS | No evidence of corrosion | Pass |
| Copper Corrosion Test (IPC-TM 650 TM 2.6.15) | No evidence of corrosion | Pass |
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