Lead Free Solder Paste
| YF-H-10 | |
| Alloy:Sn64Ag1.0Bi35 | Package:20bottle/box |
|---|---|
| Feature | Parameter |
| Goods Solderability,Strong Joints | |
| Even Core Flux Distribution | |
| Fine Process Reliability | |
| Low Free Clearing Residue | |
| Melting Point | 185oC |
| Weight | 500g/bottle |
| Granule: | 25-45um |
| Viscosity: | 190±20Pa.S |
| YF-H-4258 | |
| Alloy:Sn42Bi58 | Package:20bottle/box |
|---|---|
| Feature | Parameter |
| Goods Solderability,Strong Joints | |
| Even Core Flux Distribution | |
| Fine Process Reliability | |
| Low Free Clearing Residue | |
| Melting Point | 138oC |
| Weight | 500g/bottle |
| Granule: | 25-45um |
| Viscosity: | 190±20Pa.S |
| YF-5H-0307 | |
| Alloy:Sn99Ag0.3Cu0.7 | Package:20bottle/box |
|---|---|
| Feature | Parameter |
| Goods Solderability,Strong Joints | |
| Even Core Flux Distribution | |
| Fine Process Reliability | |
| Low Free Clearing Residue | |
| Melting Point | 227oC |
| Weight | 500g/bottle |
| Granule: | 25-45um |
| Viscosity: | 190±20Pa.S |
| YF-6R-305 | |
| Alloy:Sn99Ag3.0Cu0.5 | Package:20bottle/box |
|---|---|
| Feature | Parameter |
| Goods Solderability,Strong Joints | |
| Even Core Flux Distribution | |
| Fine Process Reliability | |
| Low Free Clearing Residue | |
| Melting Point | 217oC |
| Weight | 500g/bottle |
| Granule: | 25-45um |
| Viscosity: | 190±20Pa.S |
| YF-H-03 | |
| Alloy:Sn64.7Ag0.3Bi35 | Package:20bottle/box |
|---|---|
| Feature | Parameter |
| Goods Solderability,Strong Joints | |
| Even Core Flux Distribution | |
| Fine Process Reliability | |
| Low Free Clearing Residue | |
| Melting Point | 178oC |
| Weight | 500g/bottle |
| Granule: | 25-45um |
| Viscosity: | 190±20Pa.S |
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